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doc. no : qw0905-lg -192irr-ct rev : a date : 29 - jun. - 2016 data sheet LG-192IRR-CT led smd ligitek electronics co.,ltd. property of ligitek only lead-free part s pb l dcc
part no. LG-192IRR-CT part no LG-192IRR-CT device selection guide: features: 1. package in 8.0mm carrier t ape on 7" diameter reel. 2. low forward voltage 3. good spectral matching to si photo detect descriptions: 1. the lg-192irr is an minature infrared emitting smd package which is molded in a water clear encapsulant . 2. the device is spectrally matched with silicon photodiode and phototransistor. applications: 1. pcb mounted infrared sensor 2. infrared emitting for miniature light barrier 3. floppy disk drive 4. optoelectronic switch 5. smoke detector gaalas material emitted infrared color lens water clear ligitek electronics co.,ltd. property of ligitek only page 1/11
0.3 resin 1.6 0.4 led dice note : 1.all dimension are in millimeter tolerance is 0.1mm unless otherwise noted. 2.specifications are subject to change without notice. recommended soldering pad dimensions note : the tolerances unless mentioned is 0.1mm,angle 0.5. unit=mm. 0.8 0.7 0.8 0.8 1.0 0.3 1.0 pcb soldering terminal 0.6 package dimensions ! ligitek electronics co.,ltd. property of ligitek only anode mark 0.8 0.2 anode mark page 2/11 part no. LG-192IRR-CT
note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the radiant intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) ligitek electronics co.,ltd. property of ligitek only absolute maximum ratings at ta=25 page 3/11 part no. LG-192IRR-CT peak 2 1/2 symbol peak emission wavelength viewing angle spectral line half-width forward voltage v f radiant intensity items po ---- ---- ---- 120 ---- ---- 1.4 50 deg ---- nm 2.0 ---- v if=20ma if=20ma if=20ma condition 1.8 1.1 940 min. typ. ---- nm unit max. if=20ma if=20ma -40 ~ +85 -40 ~ +100 ir reverse current ---- ---- 100 if=20ma mw/sr a 150 i fp peak forward current (1khz 1/10 duty) operating temperature storage temperature forward current reverse voltage t opr tstg vr i f 5 50 parameter power dissipation pd symbol ratings 80 ma ma v mw unit
! ligitek electronics co.,ltd. property of ligitek only part no. LG-192IRR-CT page 4/11 luminous intensity classification po(mw/sr) at 20ma bin code min. max. k1.11.4 l1.4 1.8 m 1.8 2.4 n2.4 3.2
typical electro-optical characteristics curve ! ligitek electronics co.,ltd. property of ligitek only part no. LG-192IRR-CT page 5/11 fig.1 forward current vs. forward voltage irr chip fig.2 relative radiant power vs. wavelength forward dc voltage normalize @20ma, 25 0.8 0.9 -40 1.0 1.1 1.2 relative radiant power normalize @20ma 1.0 1 0.1 10.0 forward current[ma] 100 0.1 0.0 1 10 1000 forward voltage[v] fig.3 relative radiant power vs. forward dc current 1.0 1.5 1050 vs. forward peak current fig.4 relative radiant power 2.5 2.0 wavelength[nm] 850 800 900 1000 950 1100 100 1000 i fdc [ma] fig.5 forward dc voltage vs. temperature 10 fig.6 relative radiant power vs. temperature 100 10 i fpk [ma] 100 ambient temperature(c) 40 -20 0 20 ambient temperature(c) 80 60 100 80 20 -20 -40 0 40 60 0.5 1.0 relative radiant power normalize @20ma 0.0 relative radiant power normalize @ 20ma, 25 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.1 1.0 10.0 relative radiant power normalize @100 ma
label label aluminum moist-proff bag LG-192IRR-CT part no. 8.0mm tape,7"reel description packing specifications ? note : the tolerances unless mentioned is 0.1mm,angle 0.5. unit=mm. 4000 devices quantity/reel ! ligitek electronics co.,ltd. property of ligitek only carrier tape dimensions page 6/11 part no. LG-192IRR-CT 0.6 1.75 0.23 8.0 0.3 5.4 3.5 0.2 2.0 polarity 0.9 4.0 0.2 1.75 4.0 0.2 1.5 0.6 1.75 0.23
bin : luminous intensity hue : dominant wavelength vf : forward voltage label explanation reel dimensions 6.0 1.0 9.0 1.0 12.0 1.0 178 1.5 13.5 1.0 0.4 0.8 0.6 0.2 0.2 0.6 0.8 0.4 2.0 0.5 ligitek electronics co.,ltd. property of ligitek only page 7/11 part no. LG-192IRR-CT ligitek electronics co., ltd. vf:1.3-1.5 bin/hue : k qty(pcs): lot : part : pb LG-192IRR-CT gs11410168 4000
box explanation 1. 5 bag / inner box 2. inner box size : l x w x h 23cm x 8.5cm x 26cm h l w ! ligitek electronics co.,ltd. property of ligitek only page 8/11 part no. LG-192IRR-CT 3. 10 inner boxes / carton 4. carton size : l x w x h 58cm x 34cm x 35cm l w h
! ligitek electronics co.,ltd. property of ligitek only recommended soldering conditions page 9/11 part no. LG-192IRR-CT 1. hand solder basic spec is 280 3 sec one time only. Q 3.after soldering,do not warp the circuit board. note: 1.reflow soldering should not be done more than two times. 2.when soldering,do not put stress on the leds during heating. 120 sec.max. preheat 180~200c 2 pb-free reflow solder 1~5c/sec 260c max. 10sec.max above 220c 60 sec.max. 1~5c/sec 6c/sec
esd(electrostatic discharge): static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. cleaning: use alcohol-based cleaning solvents such as isopropyl alcohol to clean the led. (a) recommended circuit. (b) the difference of brightness between led could be found due to the vf-if characteristics of led. circuit model a led circuit model b led drive method: led is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. this current limiting typically takes the form of a current limiting resistor placed in series with the led. consider worst case voltage variations than could occur across the current limiting resistor. the forwrd current should not be allowed to change by more than 40% of its desired value. ! ligitek electronics co.,ltd. property of ligitek only page 10/11 part no. LG-192IRR-CT precautions for use: storage time: 1. calculated shelf life before opening is 18 months at < 30c and < 90% relative humidity (rh) 2. after bag is opened, devices which will be subjected to reflow soldering or other high temperature processes must be a) assemblied within one years in an environment of Q 30c / 60% rh, or b) stored at ambient of 10% rh or less 3. devices are required baking before assembly if: a) humidity indicator card reads >10% (for level 2a -5a) or >60% (for level 2) at ambient temperature 23 5c b) 2.a) or 2.b) doesn't meet 4. if baking is required, devices should be baked for >24 hours at 605c.performing baking only once, and using the baked devices within 72 hours..
! ligitek electronics co.,ltd. property of ligitek only reliability test: page 11/11 part no. LG-192IRR-CT environmental test 1.t=260c max. 10sec.max. 2. 6 min ir reflow 1.100c5c ~ -40c5c 30mins / 5mins / 30mins 2.100 cyeles temperature cycling endurance test classification 1.ta=85c 2.rh=85% 3.t=1000hrs(-24hrs,+72hrs) 1.ta=-40c5c 2.t=1000 hrs (-24hrs,+72hrs) 1.ta=100c5c ~ -40c5c 20min/ 10sec / 20min 2.total 100 cycles high temperature high humidity storage test thermal shock test low temperature storage test 1.ta=100c5c 2.t=1000 hrs (-24hrs,+72hrs) 1.ta=25c 2.if=20ma 3.t=1000 hrs (-24hrs,+72hrs) high temperature storage test test item operating life test test condition sample size 22 22 22 22 22 22 22

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